MicroLine 300
关键尺寸的自动化光学测量系统
MicroLineTM 300是一款高性能测量晶圆、光罩、MEMS和其他微加工设备等关键尺寸的自动化测量系统。该系统配备了高质量光学显微镜和移动平台,可对200mm的晶圆上0.5μm到400μm的特征尺寸进行全自动的视场测量。
- 200 x 200mmX-Y平台
- 基于视觉的自动聚焦获得影像质量
- 自动照明可编程光强
- 用于测量透明层、不规则边缘的线、厚膜等的强劲性能
- 完全可编程的序列,包括自动聚焦和关键尺寸测量
- 电动的6目物镜转换器,软件控制
- 可选的透射照明
技术规格:
- 测量行程: 200 x 200 x 25mm (XYZ)
- 平台运行: 交叉滚轴手动同轴定位和快速释放
- 视场内的测量精度: 0.010μm (用100物镜)
- 特征尺寸: 视场内0.5μm - 400μm
- FOV测量重复性: <0.010μm on wafers (用100物镜)
<0.005μm on photomasks (用100物镜)
- 照明: 石英卤素灯, 反射光
自动照明
- 低噪音CCD VGA格式摄像头
- 图像处理60帧每秒
MicroLine 300的典型应用包括:
- 晶圆
- 光罩
- MEMS
- 微型组件
测量类型:
- 关键尺寸:
线宽 Linewidth
节距 Pitch
间隙 Spacing
- Overlay
Multi-layer registration
Box in box
Circle
Edge roughness
Butting error
MicroLine 300
Automated Optical Critical Dimension Metrology System
The MicroLineTM 300 is a high-performance Critical Dimension Measurement System for wafers, masks, MEMS, and other micro-fabricated devices. This capable instrument provides precise automated field-of-view measurement of features ranging in size from 0.5μm to 400μm on wafers up to 200mm.
- 200 x 200mm Precision X-Y stage
- Vision-based autofocus for Optimum image quality
- Autoillumination Programmable light intensity
- Robust capacities for measuring transparent Layers, lines with irregular edges, thick films and more
- Fully Programmable Sequences including autofocus and Critical Dimension Measurement
-
Motorized 6-Objective nosepiece with software co
ntrol - Optional transmitted illumination
Technical Specification
- Stage Travel: 200 x 200 x 25mm (XYZ)
- Stage Type: crossed-roller with manual co-axial positioning and quick release
- Measurement Accuracy in the field of view: 0.010μm (with 100 objective lens)
- Feature size: 0.5μm - 400μm within the field of view
- FOV Measurement repeatability: <0.010μm on wafers (with 100 objective lens)
<0.005μm on photomasks (with 100 objective lens)
- Illumination: Quartz-halogen, reflected light
Autoillumination
- Low-noise CCD VGA format camera
- Image processing at 60 frames per second
Typical Applications for MicroLine 300 include:
- Wafers
- Photomasks
- MEMS
-
Micro-scale compo
nents
Measurement Types:
- Critical Dimensions:
Linewidth
Pitch
Spacing
- Overlay
Multi-layer registration
Box in box
Circle
Edge roughness
Butting error